Applications:
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Wafer Cleaning: Removes organic and inorganic residues, ensuring clean and defect-free surfaces.
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Oxide Layer Formation: Aids in controlled oxidation processes for high-quality thin film and surface layers.
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Etching: Provides precise etching for circuit patterning and surface structuring.
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Metal Contaminant Removal: Eliminates metal impurities, ensuring optimal material performance.
Our company offers Integrated Circuit Grade Nitric Acid (70% concentration) in Drum packaging, designed to maintain the high purity and quality necessary for semiconductor applications. For more details or to inquire about tailored solutions, please feel free to contact us.