Applications include:
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Wafer Surface Cleaning: Effectively removes native silicon oxide layers, ensuring a clean surface for further processing.
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Buffered Oxide Etching (BOE): When combined with hydrofluoric acid, provides stable and controlled etching for oxide layer removal.
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Surface Activation: Enhances material adhesion, crucial for thin-film deposition and semiconductor manufacturing.
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Process Refinement: Improves precision in various semiconductor processes, ensuring high-quality results.
Our company offers Semiconductor Grade Ammonium Fluoride with a concentration of 40% in Tote and Drum packaging, providing flexible solutions for various operational needs. For any specific requirements or tailored solutions, please feel free to contact us.