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Semiconductor Grade
Semiconductor Grade Electronic Grade Industrial Grade Integrated Circuit Grade Package Type
Buffered Oxide Etchant
Buffered Oxide Etchant
Buffered Oxide Etchant

Buffered Oxide Etchant (BOE) is a crucial chemical in semiconductor manufacturing, specifically designed for precise oxide layer etching. It provides a stable and controlled etch rate for removing silicon dioxide layers while offering high selectivity, protecting silicon substrates. This makes it ideal for micron- and nanoscale processes. Additionally, BOE is used for dielectric layer removal, surface cleaning, and process preparation, enhancing thin-film adhesion and deposition uniformity. BOE is essential for high-precision manufacturing in the semiconductor industry. 

Detailed introduction

Applications include: 

  • Silicon Dioxide Layer Removal: Provides controlled etching of silicon dioxide to prepare substrates for further processing. 

  • Surface Cleaning: Effectively removes contaminants and prepares surfaces for enhanced adhesion in subsequent processes. 

  • Dielectric Layer Etching: Ensures precise etching for applications in semiconductor device fabrication. 

  • Thin Film Deposition: Enhances uniform deposition and improves film adhesion, contributing to the high performance of electronic devices. 

Our company offers Buffered Oxide Etchant (BOE) in Tote and Drum packaging to meet various industrial needs. For further inquiries or customized solutions, please feel free to contact us. 

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